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Intensified collaboration will advance high-volume production with current EUV lithography and develop future EUV systems.
October 22, 2018
By: Anthony Locicero
Copy editor, New York Post
imec and ASML Holding N.V. (ASML) jointly announced the next step in their extensive collaboration. Together, they will accelerate the adoption of EUV lithography for high-volume production, including the latest available equipment for EUV (0.33 Numerical Aperture, NA). Moreover, they will explore the potential of the next-generation high-NA EUV lithography to enable printing of even smaller nanoscale devices advancing semiconductor scaling towards the post 3-nanometer Logic node. To this...
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